Multi-chip module single package structure for semiconductor

ABSTRACT

The invention is to provide a semiconductor light-emitting device package structure. The semiconductor light-emitting device package structure includes a substrate, N sub-mounts and N semiconductor light-emitting die modules, where N is a positive integer lager than or equal to 2. Each of the sub-mounts is embedded on the substrate and exposed partially. Each of the semiconductor light-emitting die modules is mounted on the exposed surface of one of the sub-mounts.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention is related to a semiconductor light-emittingdevice package structure, and more particularly, to a multi-chip modulesingle package structure for semiconductor light-emitting dies.

2. Description of the Prior Art

Because of the advantages of long life span, light weight, low powerconsumption, and absence of mercury, semiconductor light-emittingdevices, such as light-emitting diode (LED), has become an ideal lightsource, and it has been greatly developed. LED can be applied in manyfields, including information, communication, consumer electronics,vehicles, traffic light, billboard, and illumination market.

However, current high power semiconductor light emitting devices face aproblem of overheating after continued lighting for a period.Furthermore, current semiconductor light-emitting device packagestructures generally face the problem of exceeding heat resistance,which affects the power and efficiency of lighting. Therefore,conventional semiconductor light emitting device package structures cannot reduce the temperature of the light emitting device by simplyproviding a heat sink. Accordingly, there is a need to provide a packagestructure with high heat dissipating efficiency to solve the problem ofexceeding heat resistance between the interface of the package structureand the heat dissipating module.

Furthermore, the conventional package structure for semiconductorlight-emitting device is applied for packaging single semiconductorlight-emitting device. However, to deal with the development of novellighting product, there is a need to develop a multi-chip module singlepackage structure for semiconductor light-emitting dies.

SUMMARY OF THE INVENTION

Accordingly, a scope of the invention is to provide a multi-chip modulesingle package structure for semiconductor light-emitting dies.

In a preferred embodiment, a multi-chip module single package structureof the invention includes a substrate, N sub-mounts, and N semiconductorlight-emitting die modules. The substrate thereon defines a top surfaceand a bottom surface, and N first recesses are formed on the topsurface, and N second recesses are formed on the bottom surface. Each ofthe second recesses is passed through and linked together with one ofthe first recesses. A plurality of outer electrodes are disposed on thetop surface. Moreover, N is a positive integer equal to or larger than2. Particularly, the substrate is not formed by injection molding.

Additionally, each of the N sub-mounts corresponds to one of the secondrecesses and thereon defines a respective first surface and a respectivesecond surface. Each of the sub-mounts is embedded in the correspondingsecond recess such that the first surface of said one sub-mount ispartially exposed within the corresponding first recess.

Furthermore, each of the N semiconductor light-emitting die modulescorresponds to one of the sub-mounts and is mounted on the exposed firstsurface of the corresponding sub-mount within the corresponding firstrecess. Each of the semiconductor light-emitting die modules is via theinner electrodes thereof electrically connected to the outer electrodes.

The scope of the present invention will no doubt become obvious to thoseof ordinary skill in the art after reading the following detaileddescription of the preferred embodiment, which is illustrated in thevarious figures and drawings.

BRIEF DESCRIPTION OF THE APPENDED DRAWINGS

FIG. 1A shows a top view of a semiconductor light-emitting devicepackage structure 1 of a preferred embodiment of the invention.

FIG. 1B shows a sectional view of the semiconductor light-emittingdevice package structure 1 in FIG. 1A along the line K-K.

FIG. 2 shows another embodiment of the semiconductor light-emittingdevice package structure in FIG. 1A.

FIG. 3A shows a semiconductor light-emitting device package structure 3of another preferred embodiment of the invention.

FIG. 3B shows a sectional view of the semiconductor light-emittingdevice package structure 3 in FIG. 3A along the line O-O.

FIG. 3C is a partial sectional view of the semiconductor light-emittingdevice package structure of FIG. 3A along the line P-P for illustratinganother form of the semiconductor light-emitting device packagestructure.

FIG. 4 shows another embodiment of the semiconductor light-emittingdevice package structure 3 in FIG. 3A.

DETAILED DESCRIPTION OF THE INVENTION

The present invention is to provide a multi-chip module single packagestructure for semiconductor light-emitting dies. The preferredembodiments are disclosed as below.

Please refer to FIG. 1A and FIG. 1B. FIG. 1A shows a top view of asemiconductor light-emitting device package structure 1 of a preferredembodiment of the invention. FIG. 1B shows a sectional view of thesemiconductor light-emitting device package structure in FIG. 1A alongthe line K-K. As shown in FIG. 1A, the semiconductor light-emittingdevice package structure 1 includes a substrate 12, N sub-mounts 14, andN semiconductor light-emitting die modules 16, and N is a positiveinteger equal to or larger than 2. Particularly, the semiconductorlight-emitting device package structure 1 of FIG. 1A and FIG. 1B hasthree semiconductor light-emitting die modules as an example of theinvention.

Furthermore, as shown in FIG. 1B, the substrate 12 thereon defines a topsurface 122 and a bottom surface 124. Additionally, N first recesses 126are formed on the top surface 122, whereas N second recesses 128 areformed on the bottom surface 124. Particularly, each of the secondrecesses 128 is passed through and linked together with one of the firstrecesses 126. Moreover, a plurality of external electrodes (not shown)are disposed on the top surface 122.

In addition, each of the N sub-mounts 14 corresponds to one of thesecond recesses 128 and thereon defines a respective first surface 142and a respective second surface 144. Furthermore, each of the sub-mounts14 is embedded in the corresponding second recess 128, such that thefirst surface 142 of said one sub-mount 14 is partially exposed withinthe corresponding first recess 126. In practice, each of the Nsub-mounts 14 can be formed of a semiconductor material.

Furthermore, each of the N semiconductor light-emitting die modules 16corresponds to one of the sub-mounts 14 and is mounted on the exposedfirst surface 142 of the corresponding flat sub-mount 14 within thecorresponding first recess 126. Moreover, each of the semiconductorlight-emitting die modules 16 has inner electrodes 35 thereof, which areelectrically connected to the outer electrodes 33. In practice, theshape of the substrate is not limited; for example, the substrate 12 ofFIG. 1A is a rectangle. However, for example, the substrate 12 shown inFIG. 2 is a circle. Furthermore, in FIG. 2, units that have the samenumerical label as in FIG. 1A perform the same function as therespective units in FIG. 1A, and discussion of unnecessary details willbe omitted.

In an embodiment, the semiconductor light-emitting device packagestructure 1 of the invention further includes N protruding portions (notshown) and a package material (not shown). Each of the N protrudingportions is formed around the edge of each first recess 126 on the topsurface 122. The package material is respectively filled into each ofthe protruding portions to cover each semiconductor light-emitting diemodule 16.

In another embodiment, the semiconductor light-emitting device packagestructure 1 of the invention further includes a protruding portion (notshown) and a package material (not shown). The protruding portion isformed on the top surface 122 to compass every first recess 126. Thepackage material is integratively filled into the protruding portion tocover all of the semiconductor light-emitting die modules 16.

In another embodiment, the semiconductor light-emitting device packagestructure 1 of the invention further includes a transparent cover (notshown), which is disposed on the top surface 122, for integrativelycovering all of the first recesses 126.

Referring to FIG. 3A and FIG. 3B, FIG. 3A illustrate a semiconductorlight-emitting device package structure of another preferred embodimentof the invention, and FIG. 3B shows a sectional view of thesemiconductor light-emitting device package structure 3 in FIG. 3A alongthe line O-O. Similarly, the semiconductor light-emitting device packagestructure 3 also includes a substrate 32, N sub-mounts (not shown), andN semiconductor light-emitting die modules 34, wherein N is a positiveinteger equal to or larger than 2. Furthermore, FIG. 3A shows threesemiconductor light-emitting die modules 34.

Furthermore, the semiconductor light-emitting device package structure 3further includes a carrier 36 and N heat-conducting devices 38 with asubstantial column shape. Each of the N heat-conducting devices 38 has arespective flat portion. Furthermore, the substrate 32 is via the bottomsurface thereof mounted on the carrier 36. The carrier 36 has Nformed-through holes which each corresponds to one of the sub-mounts,each of the holes is adapted to receive the insertion of one of theheat-conducting devices 38 such that the flat portion of said oneheat-conducting device 38 is tightly bonded with the correspondingsub-mount.

In an embodiment, each heat-conducting device 38 is a heat pipe or aheat column.

In an embodiment, each heat-conducting device 38 is formed of copper,aluminum, or a material with high heat conductivity.

As shown in FIG. 3A and FIG. 3B, the semiconductor light-emitting devicepackage structure 3 further includes at least a heat-dissipating fin 40.The heat-dissipating fin 40 is mounted on circumferences of theheat-conducting devices 38.

As shown in FIG. 3A to FIG. 3C, the semiconductor light-emitting devicepackage structure 3 further includes a fixing device 42, and the tailends of the heat-conducting devices 38 are fixed on the fixing device42.

Please refer to FIG. 3C. FIG. 3 is a partial sectional view of thesemiconductor light-emitting device package structure 3 of FIG. 3A alongthe line P-P, to clearly show the semiconductor light-emitting devicepackage structure 3. Furthermore, in FIG. 3C, units have the samenumerical label as in FIG. 3B, and they perform the same functions asthe respective units in FIG. 3B, so discussion of unnecessary detailswill be omitted. However, different from the semiconductorlight-emitting device package structure 3 of FIG. 3B, the front end ofeach of the heat-conducting devices 38 of the semiconductorlight-emitting device package structure 3 of FIG. 3C is curved, and theflat portion of each of the heat-conducting devices 38 is formed aroundthe front end thereof.

Please refer to FIG. 4. FIG. 4 shows another embodiment of thesemiconductor light-emitting device package structure 3 in FIG. 3A.Furthermore, in FIG. 4, units that have the same numerical label as inFIG. 3A or FIG. 3B perform the same function as the respective units inFIG. 3A and FIG. 3B, and discussion of unnecessary details will beomitted. The difference between the semiconductor light-emitting devicepackage structure in FIG. 4 and FIG. 3A/3B is that the fixing device 42of the semiconductor light-emitting device package structure 3 in FIG. 4has a round shape.

Another difference between the semiconductor light-emitting devicepackage structure in FIG. 4 and FIG. 3A/3B is that the semiconductorlight-emitting device package structure 3 in FIG. 4 further includes Nsets of heat-dissipating fins 40. Moreover, each set of theheat-conducting fins 40 is mounted on a circumference of one of theheat-conducting devices 38.

In an embodiment, the above-mentioned semiconductor light-emittingdevice package structure further includes a shade with an apertureadapted to the substrate. Furthermore, the substrate is inserted intothe aperture such that the semiconductor light-emitting semiconductorlight-emitting die modules are disposed in the shade.

In an embodiment, the above-mentioned semiconductor light-emittingdevice package structure further includes an optical module 37. Theoptical module 37 is mounted on the top surface to cover thesemiconductor light-emitting die modules to focus the light emitted bythe semiconductor light-emitting die modules.

In an embodiment, the above-mentioned semiconductor light-emittingdevice package structure further includes N optical modules 37. Each ofthe N optical modules 37 is mounted on the top surface to cover one ofthe semiconductor light-emitting die modules to focus the light emittedby said one semiconductor light-emitting die module.

In an embodiment, the above-mentioned semiconductor light-emittingdevice package structure further includes a plurality of wiresrespectively electrically connected to the outer electrodes 33 andextended to the tail ends of the heat-conducting devices.

In an embodiment, each of the semiconductor light-emitting die modulesof the above-mentioned semiconductor light-emitting device packagestructure includes at least one white light diode. In anotherembodiment, one of the semiconductor light-emitting die modules caninclude at least a blue light diode, a green light diode, or a red lightdiode. In another embodiment, one of the semiconductor light-emittingdie modules includes at least one blue light diode, at least one greenlight diode, and at least one red light diode.

Obviously, the invention provides a package structure with high heatdissipating efficiency, and the package structure is used to package atleast a semiconductor light-emitting device. Furthermore, the packagestructure of the invention can also be used to coordinate with a heatconducting device to further eliminate the heat generated by a highpower semiconductor light emitting device, so as to solve the problem ofexceeding heat resistance between the interface of the package structureand the heat dissipating module.

With the example and explanations above, the features and spirits of theinvention will be hopefully well described. Those skilled in the artwill readily observe that numerous modifications and alterations of thedevice may be made while retaining the teaching of the invention.Accordingly, the above disclosure should be construed as limited only bythe metes and bounds of the appended claims.

1. A semiconductor light-emitting device package structure, comprising:a substrate thereon defining a top surface and a bottom surface, N firstrecesses being formed on the top surface, N second recesses being formedon the bottom surface, each of the second recesses being passed throughand linked together with one of the first recesses, a plurality of outerelectrodes being disposed on the top surface, N being a positiveinteger; N sub-mounts which each corresponds to one of the secondrecesses and thereon defines a respective first surface and a respectivesecond surface, each of the sub-mounts being embedded in thecorresponding second recess such that the first surface of said onesub-mount is partially exposed within the corresponding first recess;and N semiconductor light-emitting die modules which each of the saidsemiconductor light-emitting die modules corresponds to one of thesub-mounts and is mounted on the exposed first surface of thecorresponding sub-mount within the corresponding first recess, each ofthe semiconductor light-emitting die modules being via inner electrodesthereof electrically connected to the outer electrodes; Nheat-conducting devices, wherein each of the N heat-conducting deviceshas a respective flat portion; and a carrier, which the substrate is viathe bottom surface thereof mounted on, having N formed-through holes,each of the N formed-through holes corresponds to one of the sub-mounts,and each of the N formed-through holes being adapted to receive aninsertion of one of the heat-conducting devices such that the flatportion of the one heat-conducting device is tightly bonded with thecorresponding sub-mount, wherein at least one heat-dissipating finmounted on circumferences of the heat-conducting devices.
 2. Thesemiconductor light-emitting device package structure of claim 1,further comprising: a package material respectively filled into each ofthe first recesses to cover each semiconductor light-emitting diemodule.
 3. The semiconductor light-emitting device package structure ofclaim 1, further comprising: a package material integratively filledinto all of the first recesses to integratively cover all of the Nsemiconductor light-emitting die modules.
 4. The semiconductorlight-emitting device package structure of claim 1, further comprising:a transparent cover, disposed on the top surface, for integrativelycovering all of the semiconductor light-emitting die modules.
 5. Thesemiconductor light-emitting device package structure of claim 1,further comprising: N transparent covers, disposed on the top surface,each of the N transparent covers covering one of the semiconductorlight-emitting die modules.
 6. The semiconductor light-emitting devicepackage structure of claim 1, further comprising: N sets ofheat-dissipating fins, each set of the heat-conducting fins beingmounted on a circumference of one of the heat-conducting devices.
 7. Thesemiconductor light-emitting device package structure of claim 1,wherein each of the heat-conducting devices is a heat pipe or a heatcolumn.
 8. The semiconductor light-emitting device package structure ofclaim 1, wherein each of the heat-conducting devices is formed of copperor aluminum.
 9. The semiconductor light-emitting device packagestructure of claim 1, further comprising: an optical module beingmounted on the top surface and covering the semiconductor light-emittingdie modules to focus the light emitted by the semiconductorlight-emitting die modules.
 10. The semiconductor light-emitting devicepackage structure of claim 1, further comprising: N optical modules,wherein each of the N optical modules is mounted on the top surface andcovers one of the semiconductor light-emitting die modules to focus thelight emitted by said one semiconductor light-emitting die module. 11.The semiconductor light-emitting device package structure of claim 1,wherein each of the sub-mounts is formed of a semiconductor, a ceramic,or a metal.
 12. The semiconductor light-emitting device packagestructure of claim 1, wherein each of the semiconductor light-emittingdie modules comprises at least one white light diode.
 13. Thesemiconductor light-emitting device package structure of claim 1,wherein one of the semiconductor light-emitting die modules comprises ablue light diode.
 14. The semiconductor light-emitting device packagestructure of claim 1, wherein one of the semiconductor light-emittingdie modules comprises a green light diode.
 15. The semiconductorlight-emitting device package structure of claim 1, wherein one of thesemiconductor light-emitting die modules comprises a red light diode.16. The semiconductor light-emitting device package structure of claim1, wherein one of the semiconductor light-emitting die modules comprisesat least one blue light diode, at least one green light diode, and atleast one red light diode.